High Class Insulation JP Formable Polyimide Film-DEASSCO丨Industrial Die Cut Tape Manufacturer

JP Formable Polyimide Film is a newly developed advanced PI insulating film, it can be hot pressed into any three-dimensional shape without shrinkage, the forming pressure should be about 1MP (10kg), and the optimal forming temperature is 320C to 340C . . The polyimide film retains excellent physical, chemical and mechanical properties after molding.

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Product Details

Product Name: High Class Insulation JP Formable Polyimide Film

Brand Name:Deassco

Adhesive Type:Pressure Sensitive

Material:Polyimide

Tape color:Gold

Thickness:25um, 38um, 50um, 75um, 100um, and 125um

Custom size:Yes

OEM&ODM:Ye

Feature:Excellent chemical stability /Good shear resistance/Strong dielectric property/ Good radiation resistance/UL-V0 flame resistance/ electrical voltage resistance

Application Scenario

* Aerospace

* Automotive industry - sensor or switch

* Lithium battery production

* Electronic components and equipment

* Capacitors and transformers

* Insulation of motors and transformers

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